© Reuters. Katie Hobbs, Governor of the U.S. state of Arizona, attends the 2023 U.S. Business Day and Taiwan-U.S. Supply Chain Partnership Forum in Taipei, Taiwan September 19, 2023. REUTERS/Carlos Garcia Rawlins
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By Sarah Wu
TAIPEI (Reuters) -The U.S. state of Arizona is in talks with Taiwanese chipmaker TSMC on advanced packaging, state governor Katie Hobbs stated on Tuesday, which is essential for the manufacturing of synthetic intelligence (AI) chips.
TSMC, which is constructing a $40 billion chip manufacturing unit in Arizona, has not introduced plans to construct services for advanced chip packaging in the United States. Advanced packaging processes sew a number of chips collectively right into a single gadget, decreasing the added value of extra highly effective computing.
“Part of our efforts at building the semiconductor ecosystem is focusing on advanced packaging, so we have several things in the works around that right now,” Hobbs stated on the sidelines of a U.S.-Taiwan provide chain discussion board.
Driven by a surge in demand for AI chips, TSMC has been unable to fulfil buyer demand for advanced packaging companies and has been quickly increasing capability, together with an almost T$90 billion ($2.81 billion) funding in a brand new facility in Taiwan.
In July, TSMC stated its Arizona plant could be delayed till 2025 due to a scarcity of specialist employees and it was sending technicians from Taiwan to coach native workers. Production had been resulting from begin subsequent 12 months.
Hobbs stated she didn’t anticipate additional delays.
“The project is going well in Arizona. I’m very impressed by the speed with which it’s been built and we are working through bugs and expect it to continue on schedule,” she stated.
Hobbs stated she met TSMC executives on Monday.
“We talked about our continued partnership, their investments in Arizona, how we can continue to address any issues that come up,” she stated.
“We’re continuing to make sure that we have the skilled workforce that’s needed, both on the advanced manufacturing side but also the construction side so that we can continue these investments.”
Taiwan Semiconductor Manufacturing Co Ltd, the world’s largest contract chipmaker, counts Apple (NASDAQ:) and Nvidia (NASDAQ:) amongst its main shoppers.
Taiwan President Tsai Ing-wen, assembly Hobbs on the presidential workplace later on Tuesday, praised TSMC’s Arizona plant as a logo of cooperation.
“These joint efforts also will help us create more secure and resilient supply chains,” Tsai stated.
($1 = 32.0120 Taiwan {dollars})
